Toggle Main Menu Toggle Search

Open Access padlockePrints

The Newcastle University research output collection, currently available on ePrints, will shortly be moving to a new open repository platform, Figshare. To prepare for the data migration we have paused adding new content to ePrints, and will resume once the new repository is launched. During this time you will continue to have access to ePrints (but no new content will appear). We will share updates here when available.

Integrated thermal management techniques for high power electronic devices

Lookup NU author(s): Ryan McGlen, Dr Roshan Jachuck, Shih-Yuan Lin

Downloads

Full text for this publication is not currently held within this repository. Alternative links are provided below where available.

Abstract

Within the electronics industry, miniaturisation of silicon components and enhanced performance has led to high power electronic devices with high packing densities. This has identified the future development of very high heat flux components. This paper reviews the development of micro-processing technology and presents a project being carried out to develop combined two-phase heat transfer and heat pipe technology with forced air convection and liquid condenser systems. It also presents a research project being carried out at Newcastle University to develop micro-channel heat exchanger technology. © 2004 Elsevier Ltd. All rights reserved.

Publication metadata

Author(s): McGlen RJ, Jachuck R, Lin S

Publication type: Article

Publication status: Published

Journal: Applied Thermal Engineering

Year: 2004

Volume: 24

Issue: 8-9

Pages: 1143-1156

ISSN (print): 1359-4311

ISSN (electronic): 1873-5606

Publisher: Pergamon

URL: http://dx.doi.org/10.1016/j.applthermaleng.2003.12.029

DOI: 10.1016/j.applthermaleng.2003.12.029

Altmetrics

Altmetrics provided by Altmetric

Share