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Electrodeposition of gold from a thiosulfate-sulfite bath for microelectronic applications

Lookup NU author(s): Dr Todd Green, Professor Sudipta Roy

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Abstract

The feasibility of using a thiosulfate-sulfite bath to electrodeposit soft gold for microelectronic applications has been investigated. This bath is stable at near-neutral pH. shows good compatibility with positive photoresists, and does not contain any additives. It was found that the bath produced gold bumps with straight sidewalls, flat top surfaces, and a good reproduction of the resist pattern was achieved. The thickness uniformity, roughness, stress, hardness, adhesion, and shape of the plated structures were found to be compatible with the requirements for a wide range of microelectronic applications, including wafer bumping.

Publication metadata

Author(s): Green TA, Liew M-J, Roy S

Publication type: Article

Publication status: Published

Journal: Journal of the Electrochemical Society

Year: 2003

Volume: 150

Issue: 3

Pages: C104-C110

ISSN (print): 0013-4651

ISSN (electronic): 1945-7111

Publisher: Electrochemical Society, Inc.

URL: http://dx.doi.org/10.1149/1.1541006

DOI: 10.1149/1.1541006

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