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Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method

Lookup NU author(s): Albert Serra, Simon Coleman, Professor Sudipta Roy

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Abstract

A patterned anode tool was used to transfer electrodeposited microstructures on to an un-patterned A7 sized cathode by maintaining very narrow separation (300 mu m) between the two electrodes and agitating the fluid in the inter-electrode gap by ultrasonic means. A non-acidic copper solution with a low content of metal ions and additives was used. Limiting current experiments were initially performed to demonstrate that improved and uniform agitation could be maintained within the inter-electrode gap at relatively low ultrasonic powers of 5 to 30 W L-1. The best pattern definition was obtained at a US power of 5 W L-1 and a current density of 20 mA cm(-2). Importantly, the results obtained were comparable to those obtained by conventional through-mask plating. A single anode tool could be used to pattern up to five substrates, substantially minimising the amount of lithographic processing required. These results suggest that the proposed technique is a useful mask-less microfabrication process for pattern transfer on to large substrates. (C) 2016 Elsevier Ltd. All rights reserved.

Publication metadata

Author(s): Serra A, Coleman SJ, Gomez E, Green TA, Valles E, Vilana J, Roy S

Publication type: Article

Publication status: Published

Journal: Electrochimica Acta

Year: 2016

Volume: 207

Pages: 207-217

Print publication date: 20/07/2016

Online publication date: 30/04/2016

Acceptance date: 02/04/2016

ISSN (print): 0013-4686

ISSN (electronic): 1873-3859

Publisher: Elsevier

URL: http://dx.doi.org/10.1016/j.electacta.2016.04.003

DOI: 10.1016/j.electacta.2016.04.003

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