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Mixed wire and surface-wave communication fabrics for decentralized on-chip multicasting

Lookup NU author(s): Ammar Karkar, Dr Terrence Mak, Professor Alex YakovlevORCiD

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Abstract

Network-on-chip (NoC) has emerged to tackle different on-chip challenges and has satisfied different demands in terms of high performance, economical and reliable interconnect implementation. However, a merely metal-based interconnect reaches performance bound with the relentless technology scaling. Especially, it displayed a bottleneck to meet the communication bandwidth demand for multicasting. This paper proposes a novel hybrid architecture, which improves the on-chip communication bandwidth significantly using mixed wires and surface wave interconnects (SWI) fabrics. In particular, the bandwidth of multicasting can be drastically improved. We introduce a decentralized arbitration method to fully utilize the slack-time scheduling with deadlock-free flow control. Evaluation results, based on a cycleaccurate and hardware-based simulation, demonstrate the effectiveness of the proposed architecture and methods. Compared to a wire-based NoC, the mixed fabric approach can achieve an improvement in power reduction and communication speed up to 63% and 12X, respectively. These results are achieved with almost negligible hardware overheads. This new paradigm efficiently addresses the emerged challenges for on-chip communications

Publication metadata

Author(s): Karkar A, Tong K-F, Mak T, Yakovlev A

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: Design, Automation & Test in Europe Conference & Exhibition (DATE)

Year of Conference: 2015

Pages: 794-799

Print publication date: 09/03/2015

Online publication date: 09/03/2015

Acceptance date: 31/10/2014

Publisher: EDAA

URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7092494&isnumber=7092347

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