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Electrodeposition of tin-rich Cu-Sn alloys from a methanesulfonic acid electrolyte

Lookup NU author(s): Naray Pewnim, Professor Sudipta Roy

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Abstract

A systematic approach for the selection of electrochemical parameters for the electrodeposition of tin-rich copper-tin alloys has been performed. This was enabled by using a Cu:Sn ratio of 1:10 in the electrolyte. The effect of this metal ion ratio in the electrolyte and surfactants on the tin content in the deposit was examined using a rotating disk electrode. Cyclic voltammetry showed that inclusion of surfactant in the electrolyte had no effect on the reduction potential of tin which remained at -0.45 V. However, the reduction potential for copper decreased from -0.13 to -0.18 V, thereby making alloy deposition more facile. Chronoamperometry and anodic stripping voltammetry showed that current efficiency for copper-tin deposition ranged from 92-95%. Electrodeposition experiments to obtain high Sn content were carried out at constant current using vitreous carbon electrodes. Deposits containing up to 96 wt.% tin were obtained. Cu-Sn alloys consisted of two phases, tetragonal tin and a hexagonal Cu₆Sn₅ intermetallic compound.

Publication metadata

Author(s): Pewnim N, Roy S

Publication type: Article

Publication status: Published

Journal: Electrochimica Acta

Year: 2013

Volume: 90

Pages: 498-506

Print publication date: 15/02/2013

ISSN (print): 0013-4686

ISSN (electronic): 1873-3859

Publisher: Pergamon

URL: http://dx.doi.org/10.1016/j.electacta.2012.12.053

DOI: 10.1016/j.electacta.2012.12.053

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